Samsung-Broadcom $200 billion AI memory chip deal

Samsung just signed a $200 billion deal with Broadcom.

The MOU covers HBM memory, 2nm foundry manufacturing, and advanced packaging for AI chips — running through 2030.

It's one of the largest partnerships in semiconductor history.

Read full story: https://www.bigcapitalintel.com/2026/07/samsung-broadcom-200-billion-ai-chip-deal.html